History
2020~
- 2023
-
06
- NDA signed for wirelessization of Company S’s wearable device
05- Join Development Signed with Hanwha Systems
- 2022
-
11
- K-Ground Investment Attraction
07- Fabless Challenge MPW(Multi-Project Wafer) Award
03- KAIS Investment Attraction
- 2021
-
12
- Developed Wireless V-by-1 System
- 12 Big-Star Solver Platform(Semiconductor Category) Excellence Award
11- Dadam Investment Investment Attraction
10- Developed Wireless Car Infotainment System
03- KVIC Investment Attraction
- 2020
-
12
- Company L’s TV/Audio Category POC and Joint Development MOU Signed
11- Company L’s Wireless Digital Signage Development MOU Signed
10- Big 3, MPE(Material, Parts, Equipments) Start-up Top 100
10- KAIS Investment Attraction
06- Developed ZING 100 Series EVM
04- K-Ground Investment Attraction
2017~2019
- 2019
-
2~12
- Seagate, Western Digital, Cypress Semiconductor, MEDIT, Samsung Electro-Mechanics, Samsung Electronics, SJI NDA Signed
11- Company S POC
05- Developed ZING 1.0 Chipset 2nd Gen for Mass Production
01- KAIS 1.0B KRW Investment Attraction
- 2018
-
09
- Opened U.S Branch
07- KOSMES 500M KRW Investment Attraction (Company Value: 15B KRW)
02- Wireless Solution Demonstration at 2108 Pyeong Chang Winter Olympic
- 2017
-
10
- Developed Word’s first IEEE 802.15.3e compatible chipset, the “ZING”
06- IEEE Final Approval
05- Venture Business Certification acquired
03- Established GLS Laboratory
02- Established GLS CO., Ltd.